Invention Application
US20080311704A1 RADIO FREQUENCY IDENTIFICATION (RFID) TAG LAMINATION PROCESS USING LINER
失效
无线电频率识别（RFID）TAG层叠工艺使用LINER
- Patent Title: RADIO FREQUENCY IDENTIFICATION (RFID) TAG LAMINATION PROCESS USING LINER
- Patent Title (中): 无线电频率识别（RFID）TAG层叠工艺使用LINER
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Application No.: US12187143Application Date: 2008-08-06
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Publication No.: US20080311704A1Publication Date: 2008-12-18
- Inventor: Robert R. Oberle
- Applicant: Robert R. Oberle
- Applicant Address: US PA Quakertown
- Assignee: RCD TECHNOLOGY, INC.
- Current Assignee: RCD TECHNOLOGY, INC.
- Current Assignee Address: US PA Quakertown
- Main IPC: H01L21/50
- IPC: H01L21/50 ; B29C65/02
Abstract:
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
Public/Granted literature
- US07674649B2 Radio frequency identification (RFID) tag lamination process using liner Public/Granted day:2010-03-09
Information query
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