Invention Application
- Patent Title: Structure And Method For Attaching Shield Case To Circuit Board, Electronic Component Module And Portable Telephone
- Patent Title (中): 电路板，电子元件模块和便携式电话机的结构和方法
-
Application No.: US11813525Application Date: 2006-01-13
-
Publication No.: US20090016039A1Publication Date: 2009-01-15
- Inventor: Takashi Imamura
- Applicant: Takashi Imamura
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2005-006367 20050113
- International Application: PCT/JP2006/300787 WO 20060113
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K3/34
Abstract:
A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.
Information query
