Invention Application
- Patent Title: CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF
- Patent Title (中): 电路材料，电路层压板及其制造方法
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Application No.: US12504996Application Date: 2009-07-17
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Publication No.: US20100015404A1Publication Date: 2010-01-21
- Inventor: Sankar K. Paul , Christopher J. Caisse , Dirk M. Baars , Allen F. Horn, III
- Applicant: Sankar K. Paul , Christopher J. Caisse , Dirk M. Baars , Allen F. Horn, III
- Applicant Address: US IL Lincolnwood
- Assignee: WORLD PROPERTIES, INC.
- Current Assignee: WORLD PROPERTIES, INC.
- Current Assignee Address: US IL Lincolnwood
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B32B3/10 ; B32B37/00
Abstract:
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
Public/Granted literature
- US08187696B2 Circuit materials, circuits laminates, and method of manufacture thereof Public/Granted day:2012-05-29
Information query
