Invention Application
- Patent Title: B-STAGE THERMAL CONDUCTIVE DIELECTRIC COATED METAL-PLATE AND METHOD OF MAKING SAME
- Patent Title (中): B级导热介电涂层金属板及其制造方法
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Application No.: US12183425Application Date: 2008-07-31
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Publication No.: US20100028689A1Publication Date: 2010-02-04
- Inventor: Kam-Chuen Yung , Tai-Man Yue
- Applicant: Kam-Chuen Yung , Tai-Man Yue
- Main IPC: B32B15/092
- IPC: B32B15/092
Abstract:
A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.
Information query
