A method and system for fabricating an integral electromagnetic radiation shield for an electronics package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least one ground contact feature to form at least one trench above the at least one ground contact feature; depositing electromagnetic radiation shield material in the at least one trench to substantially fill the at least one trench with a trench deposit; and depositing additional electromagnetic radiation shield material over a substantial portion of the electronic package, wherein the electromagnetic radiation shield material in the trench and over the substantial portion of the electronic package form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.