Invention Application
US20100242259A1 ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE
审中-公开
电子模块和制造电子模块的方法
- Patent Title: ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE
- Patent Title (中): 电子模块和制造电子模块的方法
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Application No.: US12795613Application Date: 2010-06-07
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Publication No.: US20100242259A1Publication Date: 2010-09-30
- Inventor: Kumiko Kaneko
- Applicant: Kumiko Kaneko
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Priority: JP2006-228754 20060825; JP2007-202724 20070803
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
An electronic module capable of easily determining connection reliability of an ACF connection portion is provided. Electrode wirings of a board serving as an electronic parts of a display panel are connected with ACF bonding wirings of an FPC through an ACF to make electrical connection between the FPC and the board. Two branch portions branched from each of the ACF bonding wirings extend to an edge of the FPC. Low resistance measurement of the connection portion can be performed using the electrode wiring of the board and the branch portions, so whether or not the ACF connection portion is faulty can be determined.
Information query
