Invention Application
- Patent Title: SYSTEMS AND METHODS TO LAMINATE PASSIVES ONTO SUBSTRATE
- Patent Title (中): 将基层层叠在一起的系统和方法
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Application No.: US12908317Application Date: 2010-10-20
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Publication No.: US20110034002A1Publication Date: 2011-02-10
- Inventor: Huankiat Seh , Yongki Min , Islam A. Salama
- Applicant: Huankiat Seh , Yongki Min , Islam A. Salama
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.
Public/Granted literature
- US07981758B2 Systems and methods to laminate passives onto substrate Public/Granted day:2011-07-19
Information query
IPC分类:
