Invention Application
- Patent Title: Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board
- Patent Title (中): 印刷电路板及其制造方法，以及制造印刷电路板的面板
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Application No.: US12745667Application Date: 2008-12-01
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Publication No.: US20110036618A1Publication Date: 2011-02-17
- Inventor: Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
- Applicant: Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2007-0123059 20071129
- International Application: PCT/KR08/07088 WO 20081201
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/10 ; B23Q41/00
Abstract:
Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
Public/Granted literature
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