Invention Application
US20110036619A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
FLEX-RIGID接线板及其制造方法

  • Patent Title: FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
  • Patent Title (中): FLEX-RIGID接线板及其制造方法
  • Application No.: US12989485
    Application Date: 2009-04-23
  • Publication No.: US20110036619A1
    Publication Date: 2011-02-17
  • Inventor: Atsuhiro Uratsuji
  • Applicant: Atsuhiro Uratsuji
  • Priority: JP2008-1148712008 20080425
  • International Application: PCT/JP2009/058084 WO 20090423
  • Main IPC: H05K1/00
  • IPC: H05K1/00 H05K3/46
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Abstract:
Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section (32) having a shielding layer (45) on an outer surface, and a rigid mounting section (34) having a wiring layer (47) provided on the same surface as the shielding layer (45). The shielding layer (45) and the wiring layer (47) are made of a same sheet of continuous copper foil (46). The wiring layer (47) is plated and is made thicker than the shielding layer (45). A same continuous insulating layer (48) is provided on outer sides of the shielding layer (45) and the wiring layer (47) of the mounting section (34).
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