Invention Application
- Patent Title: LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 层压陶瓷电子元件及其制造方法
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Application No.: US12850707Application Date: 2010-08-05
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Publication No.: US20110036622A1Publication Date: 2011-02-17
- Inventor: Osamu CHIKAGAWA , Tetsuya IKEDA
- Applicant: Osamu CHIKAGAWA , Tetsuya IKEDA
- Applicant Address: JP Nagaokakyo-shi
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP2009-187262 20090812
- Main IPC: H05K1/09
- IPC: H05K1/09 ; B29C65/02

Abstract:
In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers which include second conductor patterns including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer during firing are disposed in inner layer portions. The green ceramic laminate is fired to produce a multilayer ceramic substrate.
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