A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper layer and at least one prepreg layer, bringing the metallic contact partner and the printed circuit board together in such a way that the metallic contact partner is brought into contact with a contact pad on the copper layer of the printed circuit board, forming a cutout in the printed circuit board by removing the prepreg layer in at least one partial region of the contact pad, and irradiating with laser light to form a weld connection between the contact partner and the contact pad. A configuration of a rigid printed circuit board, a metallic contact partner and an electrical connection point, as well as a module having such a configuration, are also provided.