A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The substrate unit has a heat-dissipating body disposed on the circuit substrate, and one part of a top surface of the heat-dissipating body is a first inclined plane. The heat-dissipating unit has a plurality of heat-dissipating fins connected to the heat-dissipating body. The electronic unit has a plurality of electronic elements disposed on the first inclined plane of the heat-dissipating body. Each electronic element has a plurality of pins bent downwards from a bottom thereof in order to electrically connect to the circuit substrate, and heat generated by the electronic elements is transmitted to external environment by matching the heat-dissipating body and the heat-dissipating fins.