Invention Application
- Patent Title: WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT
- Patent Title (中): 湿蚀刻绝缘子和电子电路组件
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Application No.: US13006135Application Date: 2011-01-13
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Publication No.: US20110108519A1Publication Date: 2011-05-12
- Inventor: Katsuya SAKAYORI , Terutoshi Momose , Shigeki Kawano , Tomoko Togashi , Hiroko Amasaki , Nobuhiro Sakihama , Tsuyoshi Yamazaki , Michiaki Uchiyama , Hiroshi Yagi
- Applicant: Katsuya SAKAYORI , Terutoshi Momose , Shigeki Kawano , Tomoko Togashi , Hiroko Amasaki , Nobuhiro Sakihama , Tsuyoshi Yamazaki , Michiaki Uchiyama , Hiroshi Yagi
- Applicant Address: JP Tokyo-To
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-To
- Priority: JP2001-40891 20010216; JP2001-40892 20010216; JP2001-40893 20010216; JP2001-97436 20010329; JP2001-258815 20010828
- Main IPC: H05K3/00
- IPC: H05K3/00

Abstract:
The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
Public/Granted literature
- US08308967B2 Wet etched insulator and electronic circuit component Public/Granted day:2012-11-13
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