Invention Application
- Patent Title: METHOD FOR MEASURING SAMPLE AND MEASUREMENT DEVICE
- Patent Title (中): 测量样品和测量装置的方法
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Application No.: US13059601Application Date: 2009-09-16
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Publication No.: US20110139982A1Publication Date: 2011-06-16
- Inventor: Mihoko Kijima , Shunsuke Koshihara , Hitoshi Komuro , Ryoichi Matsuoka
- Applicant: Mihoko Kijima , Shunsuke Koshihara , Hitoshi Komuro , Ryoichi Matsuoka
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Priority: JP2008-252132 20080930
- International Application: PCT/JP2009/004619 WO 20090916
- Main IPC: G01N23/225
- IPC: G01N23/225

Abstract:
An object of the present invention is to provide a method that can properly carry out the evaluation of a displacement and an overlapping area between first and second patterns formed through double patterning and a device therefor.To accomplish the above object, a method and a device are provided that execute a two-step matching between combined information having information concerning the first pattern combined with design information of the second pattern formed through a second exposure of double patterning and images displaying the first and second patterns, and on the basis of a moving amount of the design information of the second pattern, a displacement amount between the first and second patterns is determined.
Public/Granted literature
- US08581187B2 Method for measuring sample and measurement device Public/Granted day:2013-11-12
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