Invention Application
- Patent Title: MAGNETICALLY SINTERED CONDUCTIVE VIA
- Patent Title (中): 通过MAGNETICTICY烧结导致
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Application No.: US12787968Application Date: 2010-05-26
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Publication No.: US20110291276A1Publication Date: 2011-12-01
- Inventor: Rajasekaran Swaminathan , Ravindranath V. Mahajan
- Applicant: Rajasekaran Swaminathan , Ravindranath V. Mahajan
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/00
Abstract:
The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic components of the microelectronic packages may have sintered conductive vias comprising sintered metal and magnetic particles.
Public/Granted literature
- US08609532B2 Magnetically sintered conductive via Public/Granted day:2013-12-17
Information query
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