Invention Application
- Patent Title: DEVICE WITH ALUMINUM SURFACE PROTECTION
- Patent Title (中): 具有铝表面保护的器件
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Application No.: US13327992Application Date: 2011-12-16
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Publication No.: US20120086075A1Publication Date: 2012-04-12
- Inventor: Kuo Bin HUANG , Ssu-Yi LI , Ryan Chia-Jen CHEN , Chi-Ming YANG , Chyi Shyuan CHERN , Chin-Hsiang LIN
- Applicant: Kuo Bin HUANG , Ssu-Yi LI , Ryan Chia-Jen CHEN , Chi-Ming YANG , Chyi Shyuan CHERN , Chin-Hsiang LIN
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A semiconductor structure with a metal gate structure includes a first type field-effect transistor having a first gate including: a high k dielectric material on a substrate, a first metal layer on the high k dielectric material layer and having a first work function, and a first aluminum layer on the first metal layer. The first aluminum layer includes an interfacial layer including aluminum, nitrogen and oxygen. The device also includes a second type field-effect transistor having a second gate including: the high k dielectric material on the substrate, a second metal layer on the high k dielectric material layer and having a second work function different from the first work function, and a second aluminum layer on the second metal layer.
Public/Granted literature
- US08237231B2 Device with aluminum surface protection Public/Granted day:2012-08-07
Information query
IPC分类: