Invention Application
- Patent Title: CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCTURE, AND BONDING METHOD
- Patent Title (中): 导电颗粒和各向异性导电膜,粘结结构和粘结方法
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Application No.: US13332555Application Date: 2011-12-21
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Publication No.: US20120090882A1Publication Date: 2012-04-19
- Inventor: Tomoyuki ISHIMATSU , Yuta Araki
- Applicant: Tomoyuki ISHIMATSU , Yuta Araki
- Applicant Address: JP Shinagawa-ku
- Assignee: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Current Assignee: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Current Assignee Address: JP Shinagawa-ku
- Priority: JP2009-168081 20090716
- Main IPC: H05K1/09
- IPC: H05K1/09 ; B32B3/00 ; H01B13/00 ; B22F1/02

Abstract:
To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.
Public/Granted literature
- US08932716B2 Conductive particle, and anisotropic conductive film, bonded structure, and bonding method Public/Granted day:2015-01-13
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