Invention Application
- Patent Title: PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET
- Patent Title (中): 压敏粘合剂组合物,压敏胶粘剂层和压敏胶粘带或薄片
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Application No.: US13295352Application Date: 2011-11-14
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Publication No.: US20120123046A1Publication Date: 2012-05-17
- Inventor: Masahito NIWA , Tooru NAKASHIMA
- Applicant: Masahito NIWA , Tooru NAKASHIMA
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2010-254296 20101112; JP2011-183098 20110824
- Main IPC: C09J139/06
- IPC: C09J139/06 ; C09J147/00 ; C09J133/24 ; C09J139/04

Abstract:
The present invention relates to a pressure-sensitive adhesive composition comprising: a monomer mixture comprising the following (a1), (a2) and (a3) or partially polymerized product thereof; and thermal-expandable fine particles: (a1): alkyl (meth)acrylate monomer having 4 to 12 carbon atoms in its alkyl moiety and having a glass transition temperature when formed into a homopolymer of lower than 0° C.; (a2): monomer having at least one nitrogen atom and one ethylenically unsaturated bond in its molecule; and (a3): monomer having one ethylenically unsaturated bond in its molecule and having a glass transition temperature when formed into a homopolymer of 0° C. or higher (excluding (a2) above).
Information query
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