Invention Application
- Patent Title: Printed Wiring Board with Dielectric Material Sections Having Different Dissipation Factors
- Patent Title (中): 具有不同耗散因素的介质材料部分的印刷电路板
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Application No.: US12954001Application Date: 2010-11-24
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Publication No.: US20120125664A1Publication Date: 2012-05-24
- Inventor: Ian Niemi , Ilkka Johannes Kartio , Kimmo Markus Perala , Kari Viljo Jalmari Virtanen , Hannu Vaino Kalevi Ventomaki
- Applicant: Ian Niemi , Ilkka Johannes Kartio , Kimmo Markus Perala , Kari Viljo Jalmari Virtanen , Hannu Vaino Kalevi Ventomaki
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/36
Abstract:
An apparatus including a first printed wiring board section and a second printed wiring board section. The first printed wiring board section includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section is directly attached with the first printed wiring board section to form a unitary printed wiring board structure. The second printed wiring board section includes a second dielectric material layer and an antenna on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.
Public/Granted literature
- US08716603B2 Printed wiring board with dielectric material sections having different dissipation factors Public/Granted day:2014-05-06
Information query
