Invention Application
- Patent Title: CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 圆筒包装，包括其的电子装置及其制造方法
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Application No.: US13298512Application Date: 2011-11-17
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Publication No.: US20120127660A1Publication Date: 2012-05-24
- Inventor: Kang Won LEE , Hyun Joo KIM , Gyujei LEE
- Applicant: Kang Won LEE , Hyun Joo KIM , Gyujei LEE
- Applicant Address: KR Icheon-si
- Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee Address: KR Icheon-si
- Priority: KR10-2010-0115716 20101119
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K3/30 ; H05K1/11 ; H05K1/02 ; H05K1/18
Abstract:
Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided.
Information query
