Invention Application
- Patent Title: WAFER-SCALE NEEDLE ARRAY
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Application No.: US13118171Application Date: 2011-05-27
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Publication No.: US20120132613A1Publication Date: 2012-05-31
- Inventor: Rajmohan Bhandari , Sandeep Negi , Florian Solzbacher , Richard A. Normann
- Applicant: Rajmohan Bhandari , Sandeep Negi , Florian Solzbacher , Richard A. Normann
- Main IPC: B44C1/22
- IPC: B44C1/22 ; H01B13/00

Abstract:
Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of less than about 2% can be produced.
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