Invention Application
US20120156502A1 ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
审中-公开
胶粘膜，多层电路板，电子元件和半导体器件
- Patent Title: ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Patent Title (中): 胶粘膜，多层电路板，电子元件和半导体器件
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Application No.: US13393305Application Date: 2010-09-09
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Publication No.: US20120156502A1Publication Date: 2012-06-21
- Inventor: Kenzou Maejima , Satoru Katsurayama
- Applicant: Kenzou Maejima , Satoru Katsurayama
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2009-214528 20090916
- International Application: PCT/JP2010/005510 WO 20100909
- Main IPC: B32B27/38
- IPC: B32B27/38 ; H01L23/488 ; H05K1/02
Abstract:
Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa·s, and the adhesive film satisfies the following formula (1) when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss temperature by thermogravimetry of the adhesive film is defined as (b), (b)−(a)≧100 degrees centigrade (1).
Information query
