Invention Application
- Patent Title: MODULAR JACK WITH MAGNETIC MODULE OD REDUCED PROFILE
- Patent Title (中): 具有磁性模块的模块式插孔减少轮廓
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Application No.: US13241294Application Date: 2011-09-23
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Publication No.: US20120171898A1Publication Date: 2012-07-05
- Inventor: BING WANG , YONG-CHUN XU
- Applicant: BING WANG , YONG-CHUN XU
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Priority: CN201010614551.9 20101230
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/66

Abstract:
An electrical connector (100) includes an insulative housing (11), a terminal module received in the insulative housing and a shielding shell (17) enclosing the insulative housing. The terminal module having an inner circuit board (130) and a number of magnetic coils (132). The inner circuit board defines a groove (1300). Each of magnetic coils includes a core and a number of wires wound on the core and electrically connected with the inner circuit board. Each magnetic coil is at least partially received in the groove to save space for reducing profile of the connector.
Public/Granted literature
- US08439711B2 Modular jack with magnetic module od reduced profile Public/Granted day:2013-05-14
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