Invention Application
US20120174805A1 Method and System for Performing Hole-Plugging Process on Circuit Board
审中-公开
电路板上进行孔堵工艺的方法与系统
- Patent Title: Method and System for Performing Hole-Plugging Process on Circuit Board
- Patent Title (中): 电路板上进行孔堵工艺的方法与系统
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Application No.: US13383978Application Date: 2010-07-13
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Publication No.: US20120174805A1Publication Date: 2012-07-12
- Inventor: Wen Te Chen , Yueh Ching Chen , Chen Chen
- Applicant: Wen Te Chen , Yueh Ching Chen , Chen Chen
- Applicant Address: CN Zhuhai CN Beijing
- Assignee: ZHUHAI FOUNDER TECHNOLOGY MULTILAYER PCB CO., LTD. FUSHAN BRANCH,PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
- Current Assignee: ZHUHAI FOUNDER TECHNOLOGY MULTILAYER PCB CO., LTD. FUSHAN BRANCH,PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
- Current Assignee Address: CN Zhuhai CN Beijing
- Priority: CN200910088289.6 20090713
- International Application: PCT/CN2010/075121 WO 20100713
- Main IPC: B41L13/14
- IPC: B41L13/14

Abstract:
The present application discloses a method for performing a hole-plugging process on a circuit board. The method comprises: forming at least two locating holes on the circuit board; delivering the circuit board to a locating area of a hole-plugging screen printer, and adjusting a moving path of the circuit board in the locating area according to a locating device of the hole-plugging screen printer and the locating holes; and transporting the circuit board to a screen printing area of the hole plugging screen printer automatically according to the moving path, and adjusting a hole-plugging stencil of the hole-plugging screen printer to align an inking point of the hole-plugging stencil with a hole to be plugged on the circuit board, so as to plug ink dropped from the inking point of the hole-plugging stencil into the hole. The present application discloses a system for executing above method.
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