Invention Application
- Patent Title: THERMALLY-CONDUCTIVE DOUBLE-SIDED ADHESIVE SHEET
- Patent Title (中): 导热双面粘合片
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Application No.: US13576478Application Date: 2011-01-24
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Publication No.: US20120301716A1Publication Date: 2012-11-29
- Inventor: Yoshio Terada , Junichi Nakayama , Kenji Furuta , Akira Shouji , Tatsuya Tsukagoshi , Midori Tojo
- Applicant: Yoshio Terada , Junichi Nakayama , Kenji Furuta , Akira Shouji , Tatsuya Tsukagoshi , Midori Tojo
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JPJP2010-023330 20100204
- International Application: PCT/JP2011/051161 WO 20110124
- Main IPC: B32B27/30
- IPC: B32B27/30

Abstract:
Provided is a thermally-conductive double-sided adhesive sheet capable of improving the workability when adherends are bonded to or detached from each other. The thermally-conductive double-sided adhesive sheet includes an adhesive agent layer formed of a thermally-conductive adhesive agent composition formed into a sheet, which composition including a thermally-conductive material and an acrylic polymer component, wherein a strong adhesive agent layer forming one side and a weak adhesive agent layer forming the other side of the thermally-conductive double-sided adhesive sheet are laminated in such a way that the adhesive force of the one side of the thermally-conductive double-sided adhesive sheet to an adherend is stronger than the adhesive force of the other side of the thermally-conductive double-sided adhesive sheet to the adherend.
Information query