A semiconductor package and a fabrication method are provided. The semiconductor package includes a first substrate including opposite first and second surfaces, a first through electrode penetrating the first substrate, a second substrate including opposite third and fourth surfaces, a second through electrode penetrating the second substrate, an insulating pattern interposed between the second surface of the first substrate and the third surface of the second substrate to at least partially expose the second surface of the first substrate and the third surface of the second substrate, and a connecting pattern disposed in a space defined by the insulating pattern and the first and second substrates to electrically connect the first through electrode with the second through electrode.