Invention Application
- Patent Title: Semiconductor Devices With Moving Members and Methods for Making the Same
- Patent Title (中): 具有移动成员的半导体器件及其制造方法
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Application No.: US13157994Application Date: 2011-06-10
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Publication No.: US20120313235A1Publication Date: 2012-12-13
- Inventor: Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
- Applicant: Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/50
Abstract:
The present disclosure provides an embodiment of a micro-electro-mechanical system (MEMS) structure, the MEMS structure comprising a MEMS substrate; a first and second conductive plugs of a semiconductor material disposed on the MEMS substrate, wherein the first conductive plug is configured for electrical interconnection and the second conductive plug is configured as an anti-stiction bump; a MEMS device configured on the MEMS substrate and electrically coupled with the first conductive plug; and a cap substrate bonded to the MEMS substrate such that the MEMS device is enclosed therebetween.
Public/Granted literature
- US09586811B2 Semiconductor devices with moving members and methods for making the same Public/Granted day:2017-03-07
Information query
IPC分类:
