Invention Application
- Patent Title: Printed Circuit Board Having Aluminum Traces with a Solderable Layer of Material Applied Thereto
- Patent Title (中): 具有适用材料可焊层的铝迹线的印刷电路板
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Application No.: US13582149Application Date: 2011-03-22
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Publication No.: US20120317805A1Publication Date: 2012-12-20
- Inventor: Jose Antonio Cubero Pitel , Andreu Fores Montserrat , Maria Leonor Torrijos Ezquerra
- Applicant: Jose Antonio Cubero Pitel , Andreu Fores Montserrat , Maria Leonor Torrijos Ezquerra
- Applicant Address: US MI Southfield
- Assignee: LEAR CORPORATION
- Current Assignee: LEAR CORPORATION
- Current Assignee Address: US MI Southfield
- International Application: PCT/US2011/029355 WO 20110322
- Main IPC: H05K3/10
- IPC: H05K3/10
Abstract:
A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material.
Public/Granted literature
- US09204553B2 Method for producing a printed circuit board Public/Granted day:2015-12-01
Information query
