Invention Application
- Patent Title: IMAGE SENSOR MODULE
- Patent Title (中): 图像传感器模块
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Application No.: US13524586Application Date: 2012-06-15
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Publication No.: US20120318961A1Publication Date: 2012-12-20
- Inventor: Hideki SAWADA
- Applicant: Hideki SAWADA
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2011-135235 20110617; JP2011-143670 20110629; JP2011-201732 20110915; JP2011-201955 20110915; JP2012-89467 20120410
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor module includes: a sensor IC having light receivers arranged in a main scanning direction; a lens unit configured to form an image on the sensor IC with light transferred from a read target; a first light source unit having a first output surface extending along the main scanning direction and outputting a first linear light extending along the main scanning direction from the first output surface toward the read target, the first output surface being placed at a position spaced apart from the lens unit in a sub-scanning direction; and a second light source unit having a second output surface extending along the main scanning direction and outputting a second linear light extending along the main scanning direction from the second output surface toward the read target, the second output surface being placed between the lens unit and the first output surface in the sub-scanning direction.
Public/Granted literature
- US09277083B2 Image sensor module for image reading apparatus with improved reading flexibility Public/Granted day:2016-03-01
Information query
IPC分类: