Invention Application
- Patent Title: Systems and Methods for Self-Assembling Ordered Three-Dimensional Patterns By Buckling Of Thin Films Bonded To Curved Compliant Substrates
- Patent Title (中): 自组装有序三维图案的系统和方法通过弯曲粘合到弯曲的基板的薄膜
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Application No.: US13452441Application Date: 2012-04-20
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Publication No.: US20120319329A1Publication Date: 2012-12-20
- Inventor: Xi Chen
- Applicant: Xi Chen
- Applicant Address: US NY New York
- Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee Address: US NY New York
- Main IPC: B29C53/02
- IPC: B29C53/02 ; B29C59/02
Abstract:
Self-assembled buckling patterns of thin films on compliant substrates can be used in micro-fabrication. However, most previous work has been limited to planar substrates, and buckling of films on curved substrates has not been widely explored. With the constraining effect from various types of substrate curvature, numerous new types of buckling morphologies can be derived. The morphologies not only enable true three-dimensional (3D) fabrication of microstructures and microdevices, but also can have important implications for the morphogenesis of quite a few natural and biological systems.
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