Invention Application
- Patent Title: METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD
- Patent Title (中): 制造多层电路板和多层电路板的方法
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Application No.: US13453211Application Date: 2012-04-23
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Publication No.: US20120325533A1Publication Date: 2012-12-27
- Inventor: Hideaki YOSHIMURA
- Applicant: Hideaki YOSHIMURA
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2011-141232 20110624
- Main IPC: H05K1/11
- IPC: H05K1/11 ; B23K31/02
Abstract:
A method of manufacturing a multilayer circuit board includes forming a prepreg on a surface of a first circuit board including a first region in which a plated-through hole is formed and a second region in which a solid pattern is formed, the prepreg having a first hole reaching the plated-through hole and a second hole reaching the solid pattern, filling the first hole with a conductive paste, and pressing a second circuit board on the prepreg to laminate the first circuit board and the second circuit board to each other after filling the first hole with the conductive paste.
Information query
