Invention Application
- Patent Title: WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Patent Title (中): 有线电路板及其制造方法
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Application No.: US13485274Application Date: 2012-05-31
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Publication No.: US20130014976A1Publication Date: 2013-01-17
- Inventor: Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
- Applicant: Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2011-121280 20110531; JP2012-067717 20120323
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/10 ; H05K1/05

Abstract:
[Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.
Public/Granted literature
- US09241410B2 Wired circuit board and producing method thereof Public/Granted day:2016-01-19
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