Invention Application
US20130014976A1 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 有权
有线电路板及其制造方法

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
Abstract:
[Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.
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