Invention Application
- Patent Title: SILICON CARBIDE SEMICONDUCTOR DEVICE
- Patent Title (中): 硅碳化硅半导体器件
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Application No.: US13613838Application Date: 2012-09-13
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Publication No.: US20130075759A1Publication Date: 2013-03-28
- Inventor: Keiji Wada , Takeyoshi Masuda , Toru Hiyoshi
- Applicant: Keiji Wada , Takeyoshi Masuda , Toru Hiyoshi
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Priority: JP2011-208679 20110926
- Main IPC: H01L29/161
- IPC: H01L29/161

Abstract:
A first layer has n type conductivity. A second layer is epitaxially formed on the first layer and having p type conductivity. A third layer is on the second layer and having n type conductivity. ND is defined to represent a concentration of a donor type impurity. NA is defined to represent a concentration of an acceptor type impurity. D1 is defined to represent a location in the first layer away from an interface between the first layer and the second layer in a depth direction. D1 in which 1≦ND/NA≦50 is satisfied is within 1 μm therefrom. A gate trench is provided to extend through the third layer and the second layer to reach the first layer. A gate insulating film covers a side wall of the gate trench. A gate electrode is embedded in the gate trench with the gate insulating film interposed therebetween.
Public/Granted literature
- US09000447B2 Silicon carbide semiconductor device Public/Granted day:2015-04-07
Information query
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