Invention Application
- Patent Title: ETCHING COMPOSITION, METHOD OF FORMING A METAL PATTERN AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE
- Patent Title (中): 蚀刻组合物，形成金属图案的方法和制造显示基板的方法
-
Application No.: US13600392Application Date: 2012-08-31
-
Publication No.: US20130115770A1Publication Date: 2013-05-09
- Inventor: Hong-Sick Park , Bong-Kyun Kim , Wang-Woo Lee , Ki-Beom Lee , Sam-Young Cho , Won-Guk Seo , Gyu-Po Kim
- Applicant: Hong-Sick Park , Bong-Kyun Kim , Wang-Woo Lee , Ki-Beom Lee , Sam-Young Cho , Won-Guk Seo , Gyu-Po Kim
- Priority: KR10-2011-0116469 20111109
- Main IPC: C09K13/00
- IPC: C09K13/00 ; H01L21/302
Abstract:
An etching composition for a copper-containing layer includes about 0.1% to about 30% by weight of ammonium persulfate, about 0.1% to about 10% by weight of a sulfate, about 0.01% to about 5% by weight of an acetate and about 55% to about 99.79% by weight of water. The etching composition having improved stability during storage and an increased capacity for etching
Public/Granted literature
- US08637399B2 Etching composition, method of forming a metal pattern and method of manufacturing a display substrate Public/Granted day:2014-01-28
Information query
