Invention Application
US20130119282A1 WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
审中-公开
水平包装，光学检测传感器及其形成方法
- Patent Title: WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
- Patent Title (中): 水平包装，光学检测传感器及其形成方法
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Application No.: US13670766Application Date: 2012-11-07
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Publication No.: US20130119282A1Publication Date: 2013-05-16
- Inventor: Yonggang Jin , Wee Chin Judy Lim
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd.
- Current Assignee: STMicroelectronics Pte Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L31/18
Abstract:
An optical detection sensor and method of forming same. The optical detection sensor be a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object.
Information query
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