Invention Application
US20130175554A1 LED PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING LED PACKAGE
审中-公开
LED封装基板和制造LED封装的方法
- Patent Title: LED PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING LED PACKAGE
- Patent Title (中): LED封装基板和制造LED封装的方法
-
Application No.: US13737280Application Date: 2013-01-09
-
Publication No.: US20130175554A1Publication Date: 2013-07-11
- Inventor: Sang Ho HAN , Jin Ha KIM , Chin Woo KIM , Sung Ho JEON , Seok Man CHO
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0002534 20120109
- Main IPC: H01L33/48
- IPC: H01L33/48
Abstract:
There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.
Information query
IPC分类:
