Invention Application
US20130213695A1 METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME
审中-公开
制造飞翼尾部类型刚性柔性印刷电路板及其制造的飞行尾部类型刚性柔性印刷电路板的制造方法
- Patent Title: METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME
- Patent Title (中): 制造飞翼尾部类型刚性柔性印刷电路板及其制造的飞行尾部类型刚性柔性印刷电路板的制造方法
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Application No.: US13771830Application Date: 2013-02-20
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Publication No.: US20130213695A1Publication Date: 2013-08-22
- Inventor: Yang Je LEE , Jae Ho SHIN , Han II KIM , Dek Gin YANG
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0017509 20120221
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
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