An electronic device may include an elongated dielectric substrate having opposing first and second ends, a plurality of conductive pads longitudinally spaced apart along the elongated dielectric substrate, and a plurality of silicon carbide (SiC) (e.g., PiN) diode dies. Each SiC die may have bottom and top diode terminals and may be mounted on a respective conductive pad with the bottom diode terminal in contact therewith. The electronic device may further include at least one internal wirebond between the corresponding conductive pad of one SiC diode die and the top diode terminal of a next SiC diode die, a first external lead electrically coupled to the top diode terminal of a first SiC die and extending longitudinally outwardly from the first end, and a second external lead electrically coupled to the corresponding contact pad of a last SiC diode die and extending longitudinally outwardly from the second end.