Invention Application
- Patent Title: MEMS SENSOR PACKAGE SYSTEMS AND METHODS
- Patent Title (中): MEMS传感器封装系统和方法
-
Application No.: US14136199Application Date: 2013-12-20
-
Publication No.: US20140103463A1Publication Date: 2014-04-17
- Inventor: Bernhard Winkler , Rainer Leuschner , Horst Theuss
- Applicant: Infineon Technologies AG
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H01L29/84

Abstract:
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
Public/Granted literature
- US09884757B2 MEMS sensor package systems and methods Public/Granted day:2018-02-06
Information query