Invention Application
US20140103463A1 MEMS SENSOR PACKAGE SYSTEMS AND METHODS 审中-公开
MEMS传感器封装系统和方法

MEMS SENSOR PACKAGE SYSTEMS AND METHODS
Abstract:
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
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