Invention Application
- Patent Title: LIQUID HANDLING APPARATUS
- Patent Title (中): 液体处理装置
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Application No.: US14057873Application Date: 2013-10-18
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Publication No.: US20140112838A1Publication Date: 2014-04-24
- Inventor: Ken KITAMOTO
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Priority: JP2012-230743 20121018; JP2013-174420 20130826
- Main IPC: B01L3/00
- IPC: B01L3/00

Abstract:
A liquid handling apparatus includes a substrate that includes a groove which is a channel through which a liquid can be moved on the basis of a capillary phenomenon, and a film that is bonded to the substrate to cover the opening of the groove, in which the channel has a main channel and a guide channel, the groove has a main groove that is the main channel by the film being bonded to the substrate, and a guide groove that is the guide channel by the film being bonded to the substrate, opens on a lateral surface of the main groove, and has a width narrower than the width of the main groove, and the guide groove is placed in an area on a film side of the lateral surface of the main groove and shallower than the main groove.
Public/Granted literature
- US09101934B2 Liquid handling apparatus Public/Granted day:2015-08-11
Information query
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