Invention Application
US20140112838A1 LIQUID HANDLING APPARATUS 有权
液体处理装置

  • Patent Title: LIQUID HANDLING APPARATUS
  • Patent Title (中): 液体处理装置
  • Application No.: US14057873
    Application Date: 2013-10-18
  • Publication No.: US20140112838A1
    Publication Date: 2014-04-24
  • Inventor: Ken KITAMOTO
  • Applicant: Enplas Corporation
  • Applicant Address: JP Saitama
  • Assignee: Enplas Corporation
  • Current Assignee: Enplas Corporation
  • Current Assignee Address: JP Saitama
  • Priority: JP2012-230743 20121018; JP2013-174420 20130826
  • Main IPC: B01L3/00
  • IPC: B01L3/00
LIQUID HANDLING APPARATUS
Abstract:
A liquid handling apparatus includes a substrate that includes a groove which is a channel through which a liquid can be moved on the basis of a capillary phenomenon, and a film that is bonded to the substrate to cover the opening of the groove, in which the channel has a main channel and a guide channel, the groove has a main groove that is the main channel by the film being bonded to the substrate, and a guide groove that is the guide channel by the film being bonded to the substrate, opens on a lateral surface of the main groove, and has a width narrower than the width of the main groove, and the guide groove is placed in an area on a film side of the lateral surface of the main groove and shallower than the main groove.
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