Invention Application
- Patent Title: PLATED INSTRUMENTATION PROBES AND SENSORS
- Patent Title (中): 仪表探头和传感器
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Application No.: US14331771Application Date: 2014-07-15
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Publication No.: US20150013480A1Publication Date: 2015-01-15
- Inventor: Shari L. Bugaj , Wendell V. Twelves, JR. , Grant O. Cook, III
- Applicant: United Technologies Corporation
- Main IPC: G01D11/00
- IPC: G01D11/00 ; C23C18/31 ; C25D5/48

Abstract:
A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.
Public/Granted literature
- US09663867B2 Plated instrumentation probes and sensors Public/Granted day:2017-05-30
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