Invention Application
US20150013944A1 HEAT DISSIPATING MODULE 审中-公开
散热模块

  • Patent Title: HEAT DISSIPATING MODULE
  • Patent Title (中): 散热模块
  • Application No.: US14326547
    Application Date: 2014-07-09
  • Publication No.: US20150013944A1
    Publication Date: 2015-01-15
  • Inventor: CHUN-HUNG LIN
  • Applicant: COOLER MASTER TECHNOLOGY INC.
  • Priority: TW201320411848.4 20130711
  • Main IPC: F28F3/02
  • IPC: F28F3/02
HEAT DISSIPATING MODULE
Abstract:
A heat dissipating module includes a heat dissipating unit and a fan unit. The heat dissipating unit includes a plurality of heat dissipating fins sequentially stacked on top of one another. Each of the heat dissipating fins has a first end portion and a second end portion. The first end portion of each heat dissipating fin is divided into a first inclined airflow-guiding section and a second inclined airflow-guiding section, the first inclined airflow-guiding section of the first end portion of each heat dissipating fin is bent downward and slantwise, and the second inclined airflow-guiding section of the first end portion of each heat dissipating fin is bent upward and slantwise. The fan unit includes at least one fan adjacent to the heat dissipating unit for facing the first inclined airflow-guiding section and the second inclined airflow-guiding section of the first end portion of each heat dissipating fin.
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