Invention Application
US20150014022A1 Device Components With Surface-Embedded Additives And Related Manufacturing Methods
有权
具有表面嵌入式添加剂的器件组件及相关制造方法
- Patent Title: Device Components With Surface-Embedded Additives And Related Manufacturing Methods
- Patent Title (中): 具有表面嵌入式添加剂的器件组件及相关制造方法
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Application No.: US14299938Application Date: 2014-06-09
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Publication No.: US20150014022A1Publication Date: 2015-01-15
- Inventor: Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
- Applicant: INNOVA DYNAMICS, INC.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/09

Abstract:
Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Public/Granted literature
- US09185798B2 Device components with surface-embedded additives and related manufacturing methods Public/Granted day:2015-11-10
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