Disclosed herein are an insulating film for a printed circuit board, a resin coated copper (RCC), a flexible copper clad laminate (FCCL), and a printed circuit board manufactured by using the same. More specifically, the RCC, the FCCL, and the printed circuit board manufactured by using the insulating film for the printed circuit board according to the preferred embodiment of the present invention, the insulating film including an insulating layer, and a primer layer formed on one surface of the insulating layer and including a benzocyclobutene (BCB)-based resin, may have a low coefficient of thermal expansion and high peel strength.