Invention Application
- Patent Title: HIGH-FREQUENCY SIGNAL LINE AND METHOD FOR PRODUCING BASE LAYER WITH SIGNAL LINE
- Patent Title (中): 高频信号线和信号线生成基层的方法
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Application No.: US14531058Application Date: 2014-11-03
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Publication No.: US20150048906A1Publication Date: 2015-02-19
- Inventor: Noboru KATO , Satoshi ISHINO , Jun SASAKI
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2012-147300 20120629
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P11/00 ; H01P3/02
Abstract:
A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.
Public/Granted literature
- US09627734B2 High-frequency signal line and method for producing base layer with signal line Public/Granted day:2017-04-18
Information query
