Invention Application
- Patent Title: MEMS MICROPHONE
- Patent Title (中): MEMS麦克风
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Application No.: US14684565Application Date: 2015-04-13
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Publication No.: US20150215706A1Publication Date: 2015-07-30
- Inventor: Andrew Sparks , Todd M. Borkowski
- Applicant: Sand 9, Inc.
- Main IPC: H04R17/02
- IPC: H04R17/02 ; G01L9/00

Abstract:
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
Public/Granted literature
- US09386379B2 MEMS microphone Public/Granted day:2016-07-05
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