Invention Application
- Patent Title: SEMICONDUCTOR DEVICES
- Patent Title (中): 半导体器件
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Application No.: US14574456Application Date: 2014-12-18
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Publication No.: US20150249093A1Publication Date: 2015-09-03
- Inventor: Jeonggil LEE , Yeon-Sil SOHN , Woonghee SOHN , Kihyun YOON , Myoungbum LEE , Tai-Soo LIM , Yong Chae JUNG
- Applicant: Jeonggil LEE , Yeon-Sil SOHN , Woonghee SOHN , Kihyun YOON , Myoungbum LEE , Tai-Soo LIM , Yong Chae JUNG
- Priority: KR10-2014-0025105 20140303
- Main IPC: H01L27/115
- IPC: H01L27/115

Abstract:
Provided is a semiconductor device, including gate structures on a substrate, the gate structures extending parallel to a first direction and being spaced apart from each other by a separation trench interposed therebetween, each of the gate structures including insulating patterns stacked on the substrate and a gate electrode interposed therebetween; vertical pillars connected to the substrate through the gate structures; an insulating spacer in the separation trench covering a sidewall of each of the gate structures; and a diffusion barrier structure between the gate electrode and the insulating spacer.
Public/Granted literature
- US09711523B2 Semiconductor devices Public/Granted day:2017-07-18
Information query
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