Invention Application
US20150323452A1 DYNAMIC MEASUREMENT OF MATERIAL PROPERTIES USING TERAHERTZ RADIATION WITH REAL-TIME THICKNESS MEASUREMENT FOR PROCESS CONTROL 审中-公开
使用TERAHERTZ辐射与实时厚度测量进行过程控制的材料特性的动态测量

DYNAMIC MEASUREMENT OF MATERIAL PROPERTIES USING TERAHERTZ RADIATION WITH REAL-TIME THICKNESS MEASUREMENT FOR PROCESS CONTROL
Abstract:
A method of determining material properties for an object under test is disclosed. The method comprises determining a thickness at a point on the object under test in a non-invasive manner. It also comprises obtaining a terahertz measurement by passing terahertz radiation through the object under test using a terahertz emitter and detecting the terahertz radiation using a terahertz detector. Finally, it comprises determining an optical property at the point on the object under test using a measurement value from the terahertz emitter and the terahertz detector and a measured value for the thickness at the point.
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