Invention Application
- Patent Title: SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 基板结构及其制造方法
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Application No.: US14666314Application Date: 2015-03-24
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Publication No.: US20150364499A1Publication Date: 2015-12-17
- Inventor: Kuan-Yi Lin , Po-Hsin Lin , Fang-An Shu , Cheng-Hang Hsu , Tzung-Wei Yu
- Applicant: E Ink Holdings Inc.
- Priority: TW103120716 20140616
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/49

Abstract:
A substrate structure including a flexible substrate, a gate line, a gate, an inorganic insulation layer, a semiconductor layer, a source, a drain, an inorganic passivation layer and an organic insulation layer is provided. The gate is electrically connected to the gate line. The inorganic insulation layer covers the gate and exposes a portion of the flexible substrate. The semiconductor layer is disposed on the inorganic insulation layer and disposed corresponding to the gate. The source and the drain extend from the inorganic insulation layer to the semiconductor layer and expose a portion of the semiconductor layer. The inorganic passivation layer covers portions of the source and the drain and directly contacts to the semiconductor layer exposed by the source and the drain. The organic insulation layer covers the source, the drain, the inorganic passivation layer and the flexible substrate exposed by the inorganic insulation layer.
Information query
IPC分类: