Invention Application
US20160021752A1 PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
有权
包装底座，包装，电子设备，电子设备和移动物体
- Patent Title: PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
- Patent Title (中): 包装底座，包装，电子设备，电子设备和移动物体
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Application No.: US14798859Application Date: 2015-07-14
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Publication No.: US20160021752A1Publication Date: 2016-01-21
- Inventor: Tetsuro MIYAO , Hideki ISHIGAMI , Yukihiko SHIOHARA , Tetsuya OTSUKI , Hidefumi NAKAMURA
- Applicant: Seiko Epson Corporation
- Priority: JP2014-145667 20140716
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K5/00 ; C04B41/88
Abstract:
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
Public/Granted literature
- US09769934B2 Package base, package, electronic device, electronic apparatus, and moving object Public/Granted day:2017-09-19
Information query
